A modular optical honeycomb breadboard realized with 3D-printable building bricks and industrial aluminum extrusions
DC Element | Wert | Sprache |
---|---|---|
dc.contributor.author | Toschke, Yannic | |
dc.contributor.author | Bourdon, Bjoern | |
dc.contributor.author | Berben, Dirk | |
dc.contributor.author | Imlau, Mirco | |
dc.date.accessioned | 2021-12-23T16:05:45Z | - |
dc.date.available | 2021-12-23T16:05:45Z | - |
dc.date.issued | 2021 | |
dc.identifier.uri | https://osnascholar.ub.uni-osnabrueck.de/handle/unios/7181 | - |
dc.description.abstract | Optical breadboards with honeycomb structure provide a solid surface with mounting hole grids for building optical assemblies, sub-systems and experiments in the fields of quantum-optics and photonics. Performance criteria are the ability to resist bending under load (stiffness) and the ability to dissipate induced vibrations to the board (damping). The hardware presented in this paper deals with the possibility of assembling optical breadboards using 3D-printed building bricks with honeycomb structure, so-called `breadboard bricks', and industrial aluminum extrusions, so-called `breadboard profiles'. With this do-it-yourself approach, it is possible to make changes to the breadboard, such as making an opening, changing its shape or increasing the mounting surface whenever needed. Furthermore, the breadboard is automatically compatible with industrially relevant mechanical design platforms. Aluminum extrusions and the PLA thermoplastic filament provide mechanical stiffness and damping, respectively. Further characteristics are low costs and a modular design. All this makes it especially suited for agile prototyping of (laser) optical assemblies in many engineering processes. (C) 2021 The Author(s). Published by Elsevier Ltd. | |
dc.description.sponsorship | German Federal Ministry of Education and Research (BMBF) within the funding program ``Photonics Research Germany''Federal Ministry of Education & Research (BMBF) [13N15230]; Osnabrueck University; This research is part of the project Optocubes1 and was funded by the German Federal Ministry of Education and Research (BMBF) within the funding program ``Photonics Research Germany'' with contract number 13N15230. The authors acknowledge support by the Open Access Publishing fund of Osnabrueck University. The authors are responsible for the contents of this publication. The authors would like to thank Dr.-Ing. Ulrich Kunze for his insightful discussions and feedback regarding the optical breadboard and Dr. Sebastian Muller and Dr. Hauke Bruning for their feedback and insights on their first impressions while working with the optical breadboard. | |
dc.language.iso | en | |
dc.publisher | ELSEVIER | |
dc.relation.ispartof | HARDWAREX | |
dc.subject | 3D-printing | |
dc.subject | Agile prototyping | |
dc.subject | Engineering | |
dc.subject | Engineering, Electrical & Electronic | |
dc.subject | Industrial aluminum extrusions | |
dc.subject | Instruments & Instrumentation | |
dc.subject | Interferometer | |
dc.subject | Materials Science | |
dc.subject | Materials Science, Multidisciplinary | |
dc.subject | Optical breadboard | |
dc.subject | Optics | |
dc.subject | Photonics | |
dc.subject | Spectrograph | |
dc.title | A modular optical honeycomb breadboard realized with 3D-printable building bricks and industrial aluminum extrusions | |
dc.type | journal article | |
dc.identifier.doi | 10.1016/j.ohx.2021.e00182 | |
dc.identifier.isi | ISI:000657359300023 | |
dc.description.volume | 9 | |
dc.contributor.orcid | 0000-0002-4559-4522 | |
dc.identifier.eissn | 24680672 | |
dc.publisher.place | RADARWEG 29, 1043 NX AMSTERDAM, NETHERLANDS | |
dcterms.isPartOf.abbreviation | HardwareX | |
dcterms.oaStatus | Green Published, gold | |
crisitem.author.dept | FB 04 - Physik | - |
crisitem.author.deptid | fb04 | - |
crisitem.author.orcid | 0000-0002-5343-5636 | - |
crisitem.author.parentorg | Universität Osnabrück | - |
crisitem.author.netid | ImMi360 | - |
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geprüft am 19.05.2024