A modular optical honeycomb breadboard realized with 3D-printable building bricks and industrial aluminum extrusions

DC ElementWertSprache
dc.contributor.authorToschke, Yannic
dc.contributor.authorBourdon, Bjoern
dc.contributor.authorBerben, Dirk
dc.contributor.authorImlau, Mirco
dc.date.accessioned2021-12-23T16:05:45Z-
dc.date.available2021-12-23T16:05:45Z-
dc.date.issued2021
dc.identifier.urihttps://osnascholar.ub.uni-osnabrueck.de/handle/unios/7181-
dc.description.abstractOptical breadboards with honeycomb structure provide a solid surface with mounting hole grids for building optical assemblies, sub-systems and experiments in the fields of quantum-optics and photonics. Performance criteria are the ability to resist bending under load (stiffness) and the ability to dissipate induced vibrations to the board (damping). The hardware presented in this paper deals with the possibility of assembling optical breadboards using 3D-printed building bricks with honeycomb structure, so-called `breadboard bricks', and industrial aluminum extrusions, so-called `breadboard profiles'. With this do-it-yourself approach, it is possible to make changes to the breadboard, such as making an opening, changing its shape or increasing the mounting surface whenever needed. Furthermore, the breadboard is automatically compatible with industrially relevant mechanical design platforms. Aluminum extrusions and the PLA thermoplastic filament provide mechanical stiffness and damping, respectively. Further characteristics are low costs and a modular design. All this makes it especially suited for agile prototyping of (laser) optical assemblies in many engineering processes. (C) 2021 The Author(s). Published by Elsevier Ltd.
dc.description.sponsorshipGerman Federal Ministry of Education and Research (BMBF) within the funding program ``Photonics Research Germany''Federal Ministry of Education & Research (BMBF) [13N15230]; Osnabrueck University; This research is part of the project Optocubes1 and was funded by the German Federal Ministry of Education and Research (BMBF) within the funding program ``Photonics Research Germany'' with contract number 13N15230. The authors acknowledge support by the Open Access Publishing fund of Osnabrueck University. The authors are responsible for the contents of this publication. The authors would like to thank Dr.-Ing. Ulrich Kunze for his insightful discussions and feedback regarding the optical breadboard and Dr. Sebastian Muller and Dr. Hauke Bruning for their feedback and insights on their first impressions while working with the optical breadboard.
dc.language.isoen
dc.publisherELSEVIER
dc.relation.ispartofHARDWAREX
dc.subject3D-printing
dc.subjectAgile prototyping
dc.subjectEngineering
dc.subjectEngineering, Electrical & Electronic
dc.subjectIndustrial aluminum extrusions
dc.subjectInstruments & Instrumentation
dc.subjectInterferometer
dc.subjectMaterials Science
dc.subjectMaterials Science, Multidisciplinary
dc.subjectOptical breadboard
dc.subjectOptics
dc.subjectPhotonics
dc.subjectSpectrograph
dc.titleA modular optical honeycomb breadboard realized with 3D-printable building bricks and industrial aluminum extrusions
dc.typejournal article
dc.identifier.doi10.1016/j.ohx.2021.e00182
dc.identifier.isiISI:000657359300023
dc.description.volume9
dc.contributor.orcid0000-0002-4559-4522
dc.identifier.eissn24680672
dc.publisher.placeRADARWEG 29, 1043 NX AMSTERDAM, NETHERLANDS
dcterms.isPartOf.abbreviationHardwareX
dcterms.oaStatusGreen Published, gold
crisitem.author.deptFB 04 - Physik-
crisitem.author.deptidfb04-
crisitem.author.orcid0000-0002-5343-5636-
crisitem.author.parentorgUniversität Osnabrück-
crisitem.author.netidImMi360-
Zur Kurzanzeige

Seitenaufrufe

8
Letzte Woche
0
Letzter Monat
1
geprüft am 19.05.2024

Google ScholarTM

Prüfen

Altmetric