ReDroSe - Reconfigurable Drone Setup for Resource-Efficient SLAM

Autor(en): Rahn, Sebastian
Gehricke, Philipp
Petermöller, Can-Leon
Neumann, Eric
Schlinge, Philipp
Rabius, Leon
Termühlen, Henning
Sieh, Christopher
Tassemeier, Marco
Wiemann, Thomas 
Porrmann, Mario 
Stichwörter: Computing power; Data acquisition; Digital storage; Drone; Drones; Electric power utilization; Embedded CPU; Field Programmable Gate Array; Field programmable gate arrays (FPGA); Field programmables; GPU; Graphics processing unit; Green computing; Hardware Acceleration; Heterogeneous Computing; Information management; Program processors; Programmable gate array; Reconfigurable; Resource-efficient; Rock mechanics; ROS; UAV; UAV platform
Erscheinungsdatum: 2023
Herausgeber: Association for Computing Machinery
Journal: ACM International Conference Proceeding Series
Startseite: 20 – 30
Zusammenfassung: 
In this paper we present ReDroSe, a heterogeneous compute system based on embedded CPUs, FPGAs and GPUs, which is integrated into an existing UAV platform to allow real time SLAM based on a Truncated Signed Distance Field (TSDF) directly on the drone. The system is fully integrated into the existing infrastructure to allow ground control to manage and monitor the data acquisition process. ReDroSe is evaluated in terms of power consumption and computing capabilities. The results show that the proposed architecture allows computations on the UAV that were previously only possible in post-processing while keeping the power consumption low enough to match the available flight time of the UAV. © 2023 ACM.
Beschreibung: 
Cited by: 0; Conference name: Workshop on System Engineering for Constrained Embedded Systems - Drone Systems Engineering and Rapid Simulation and Performance Evaluation: Methods and Tools, DroneSE and RAPIDO 2023 - Presented at HiPEAC 2023 Conference; Conference date: 16 January 2023 through 18 January 2023; Conference code: 187920
ISBN: 9798400700453
DOI: 10.1145/3579170.3579266
Externe URL: https://www.scopus.com/inward/record.uri?eid=2-s2.0-85156242062&doi=10.1145%2f3579170.3579266&partnerID=40&md5=b301f7ca75680bed06cc1933bc28fa28

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