ReDroSe - Reconfigurable Drone Setup for Resource-Efficient SLAM
Autor(en): | Rahn, Sebastian Gehricke, Philipp Petermöller, Can-Leon Neumann, Eric Schlinge, Philipp Rabius, Leon Termühlen, Henning Sieh, Christopher Tassemeier, Marco Wiemann, Thomas Porrmann, Mario |
Stichwörter: | Computing power; Data acquisition; Digital storage; Drone; Drones; Electric power utilization; Embedded CPU; Field Programmable Gate Array; Field programmable gate arrays (FPGA); Field programmables; GPU; Graphics processing unit; Green computing; Hardware Acceleration; Heterogeneous Computing; Information management; Program processors; Programmable gate array; Reconfigurable; Resource-efficient; Rock mechanics; ROS; UAV; UAV platform | Erscheinungsdatum: | 2023 | Herausgeber: | Association for Computing Machinery | Journal: | ACM International Conference Proceeding Series | Startseite: | 20 – 30 | Zusammenfassung: | In this paper we present ReDroSe, a heterogeneous compute system based on embedded CPUs, FPGAs and GPUs, which is integrated into an existing UAV platform to allow real time SLAM based on a Truncated Signed Distance Field (TSDF) directly on the drone. The system is fully integrated into the existing infrastructure to allow ground control to manage and monitor the data acquisition process. ReDroSe is evaluated in terms of power consumption and computing capabilities. The results show that the proposed architecture allows computations on the UAV that were previously only possible in post-processing while keeping the power consumption low enough to match the available flight time of the UAV. © 2023 ACM. |
Beschreibung: | Cited by: 0; Conference name: Workshop on System Engineering for Constrained Embedded Systems - Drone Systems Engineering and Rapid Simulation and Performance Evaluation: Methods and Tools, DroneSE and RAPIDO 2023 - Presented at HiPEAC 2023 Conference; Conference date: 16 January 2023 through 18 January 2023; Conference code: 187920 |
ISBN: | 9798400700453 | DOI: | 10.1145/3579170.3579266 | Externe URL: | https://www.scopus.com/inward/record.uri?eid=2-s2.0-85156242062&doi=10.1145%2f3579170.3579266&partnerID=40&md5=b301f7ca75680bed06cc1933bc28fa28 |
Show full item record